Thin Film Circuits
Voice: (267) 316-9999 
 
  info@thinfilmindustries.com
Thin Film Industries, Inc.
An ISO 9001:2015 Registered Company

 

Metallization Schemes

 

At Thin Film Industries, Inc., we can do up to four different metals in any combination in one pump down.

  • Resistors: Cermet, NiChrome, TaN
  • Adhesion: Titanium, Ti/Tungsten, Chromium
  • Barrier: Platinum, Nickel, Palladium
  • Conductor: Gold, Silver, Copper, Aluminum

The Thin Film facility has many other metallizations available.

Please contact us if you have any questions. We should be able to accommodate any of your metallization needs.

Defined Gold/Tin (AuSn) eutectic deposition is now available to selected areas of the circuit, eliminating the need to use AuSn preforms. This process will increase yields and reliability while keeping inventory cost down.

Browse our pages to learn more about Etching, Ceramics, and working with us.